集成电路(IC)的封装形式繁杂多样,下面是收集到的一部分集成电路的封装形式外观图与封装代号。集成电路常用元件封装如图:
封 装 样 式 | 封装代号 | 封 装 样 式 | 封装代号 |
AX078 |
Gull Wing Leads | ||
AX14 |
SOH | ||
BGA |
SOJ | ||
BPFP |
SOP | ||
C-Bend Lead |
SOT143 | ||
CLCC |
SOT223 | ||
CPGA |
SOT223 | ||
DIP |
SOT23 | ||
DIP-TAB |
SOT23 SOT323 | ||
FBGA |
SOT25 SOT353 | ||
FDIP |
SOT26 SOT363 | ||
FLAT PACK |
SOT343 | ||
FTO-220 |
SOT523 | ||
HSOP |
SOT89 | ||
ITO-3P |
SSOP | ||
ITO-220 |
SSOP | ||
JLCC |
STO220 | ||
LCC |
STO220 | ||
LDCC |
TCSP 20L | ||
LGA |
TO-18 | ||
LQFP |
TO-220 | ||
PCDIP |
TO-247 | ||
PCMCIA |
TO252 | ||
PDIP |
TO263 TO268 | ||
PGA |
TO264 | ||
PQFP |
TO-3 | ||
PLCC |
TO52 | ||
PSDIP |
TO-71 | ||
QFP |
TO-72 | ||
QGP | TO-218 | ||
SBGA |
TO-78 | ||
SC-70 |
TO8 | ||
SDIP |
TO92 | ||
SIP |
TO99 | ||
Ceramic Case |
TQFP | ||
SNAPTK |
TSOP | ||
SNAPTK |
TSSOP | ||
SO |
ZIP |