1.导线（信道）：conduction (track)
2.导线（体）宽度：conductor width
3.导线距离：conductor spacing
4.导线层：conductor layer
5.导线宽度/间距：conductor line/space
6.第一导线层：conductor layer No.1
7.圆形盘：round pad
8.方形盘：square pad
9.菱形盘：diamond pad
10.长方形焊盘：oblong pad
11.子弹形盘：bullet pad
12.泪滴盘：teardrop pad
13.雪人盘：snowman pad
14. V形盘：V-shaped pad
15.环形盘：annular pad
16.非圆形盘：non-circular pad
17.隔离盘：isolation pad
18.非功能连接盘：monfunctional pad
19.偏置连接盘：offset land
20.腹（背）裸盘：back-bard land
21.盘址：anchoring spaur
22.连接盘图形：land pattern
23.连接盘网格阵列：land grid array
24.孔环：annular ring
25.组件孔：component hole
26.安装孔：mounting hole
27.支撑孔：supported hole
28.非支撑孔：unsupported hole
29.导通孔：via
30.镀通孔：plated through hole (PTH)
31.余隙孔：access hole
32.盲孔：blind via (hole)
33.埋孔：buried via hole
34.埋/盲孔：buried /blind via
35.任意层内部导通孔：any layer inner via hole (ALIVH)
36.全部钻孔：all drilled hole
37.定位孔：toaling hole
38.无连接盘孔：landless hole
39.中间孔：interstitial hole
40.无连接盘导通孔：landless via hole
41.引导孔：pilot hole
42.端接全隙孔：terminal clearomee hole
43.准表面间镀覆孔：quasi-interfacing plated-through hole
44.准尺寸孔：dimensioned hole
45.在连接盘中导通孔：via-in-pad
46.孔位：hole location
47.孔密度：hole density
48.孔图：hole pattern
49.钻孔图：drill drawing
50.装配图：assembly drawing
51.印制板组装图：printed board assembly drawing
52.参考基准：datum referan
以上即是PCB设计中专业英译术语之形状与尺寸