1.开料：CutLamination/Material cutting
2.钻孔：Drilling
3.内钻：Inner LayerDrilling
4一次孔:Outer Layer Drilling
5.二次孔:2nd Drilling
6.雷射钻孔
aser Drilling /Laser Ablation
7.盲(埋)孔钻孔:Blind & Buried Hole Drilling
8.干膜制程：PhotoProcess(D/F)/Dry Film
9.前处理(Pretreatment)
10.压膜
ry Film Lamination
11.曝光:Exposure
12.显影eveloping
13.去膜:Stripping
14.压合：Lamination
15:黑化:Black OxideTreatment
16.微蚀:Microetching
17.铆钉组合:eyelet
18.迭板ay up
19.压合amination
20.后处理
ost Treatment
21.黑氧化:Black Oxide Removal
22.铣靶:spot face
23.去溢胶:resin flush removal
24.减铜：Copper Reduction
25.水平电镀：HorizontalElectrolytic Plating
26.电镀：Panel plating
27.锡铅电镀:Tin-Lead Plating /Pattern Plating
28.低于1 mil: Less than 1 mil Thickness
29.高于1 mil:More than 1 mil Thickness
30.砂带研磨:Belt Sanding
31:剥锡铅:Tin-Lead Stripping
32.微切片: Microsection
33.蚀铜:Etching
34.初检:Touch-up
35.塞孔：Plug Hole
36.防焊(绿漆/绿油)：SolderMask
37.C面印刷rinting Top Side
38.S面印刷rinting Bottom Side
39.静电喷涂:Spray Coating
40.前处理retreatment
41.预烤recure
42.后烘烤ostcure
43.印刷:Ink Print
44.表面刷磨:Scrub
45.后烘烤ostcure
46.UV烘烤:UV Cure
47.文字印刷rinting of Legend
48.喷砂umice/Wet Blasting
49.印可剥离防焊/蓝胶eelable Solder Mask)
50.化学前处理,化学研磨：Chemical Milling
51.选择性浸金压膜：Selective Gold Dry Film Lamination
52.镀金：Gold plating
53.喷锡：Hot Air SolderLeveling
54.成型：Profile/Form
55.开短路测试：Electrical Testing
56.终检：Final VisualInspection
57.金手指镀镍金：Gold Finger
58.电镀软金：Soft Ni/Au Plating
59.浸镍金：Immersion Ni/Au / Electroless Ni/Au
60.喷锡:Hot Air Solder Leveling
61.水平喷锡:HorizontalHot Air Solder Leveling
62.垂直喷锡: Vertical Hot Air Solder Leveling
63.超级焊锡:Super Solder
64.印焊锡突点:Solder Bump
65.数控铣/锣板：N/C Routing/Milling
66.模具冲/啤板：Punch
67.板面清洗烘烤：Cleaning & Backing
68.V型槽/V-CUT：V-Cut/V-Scoring
69.金手指斜边：Beveling of G/F
70.短断路测试Electrical Testing/Continuity & Insulation Testing
71.AOI光学检查：AOI Inspection
72：VRS目检：Verified & Repaired
73.泛用型治具测试：Universal Tester
74.专用治具测试：Dedicated Tester
75.飞针测试：Flying Probe
76.终检：Final Visual Inspection
77.压板翘：Warpage Remove
78.X-OUT印刷：X-Out Marking
79.包装及出货：Packing& shipping
80.清洗及烘烤：Final Clean & Baking
81.铜面保护剂：ENTEK Cu-106A/OSP
82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test
83.冷热冲击试验:Thermal cycling Testing
84.焊锡性试验:Solderability Testing
85.雷射钻孔aser Ablation
86.雷射钻Tooling孔aser ablationTooling Hole
87.雷射曝光对位孔aser Ablation Registration Hole
88.雷射Mask制作aser Mask
89.雷射钻孔aser Ablation
90.AOI检查及VRS:AOI Inspection & Verified & Repaired
91.除胶渣esmear
92.专用治具测试edicated Tester
93.飞针测试:Flying Probe
94.压板翘: Warpage Remove
95.底片：Ablation
96.烧溶：laser)
97.切/磨：abrade
98.粗化：abrasion
99.耐磨性：absorption resistance
100.允收:ACC /accept
101.加速腐蚀:accelerated corrosion test
102加速试验:accelerated test
103.速化反应:acceleration
104.加速剂:accelerator
105.允许：acceptable
106.活化液：activator
107.实际在制品：active work in process
108.附着力：adhesion
109.黏着法：adhesive method
110.气泡:air inclusion
111.风刀：air knife
112.不定形的改变：amorphous change
113.总量：amount
114.硝基戊烷：amylnitrite
115.分析仪：analyzer
116环状垫圈;孔环annular ring
117.阳极泥：anodeslime (sludge)
118.阳极清洗：anodizing
119.自动光学检测：AOI/automatic optical inspection
120.引用之文件：applicable documents
121.允收水平抽样：AQL sampling
122.液态光阻：aqueous photoresist
123.纵横比(厚宽比)：aspect ratioAs received
124.背光：back lighting
125.垫板：back-up
126.预留在制品：banked work in process
127.基材：base material
128.基准绩效：baseline performance
129.批：batch
130.贝他射线照射法：beta backscattering
131.切斜边;斜边：beveling
132.二方向之变形:biaxial deformation
133.黑化：black-oxide
134.空板：blank panel
135.挖空:blanking
136.弹开:blip
137.气泡:blister blistering
138.吹孔:blow hole
139.板厚错误:board-thickness error
140.黏结层:bonding plies
141.板弯:bow ; bowing
142.破空:break out
143.搭桥;桥接：bridging
144.接单生产：BTO (Build To Order)
145,.烧焦：burning
146.毛边(毛头)：burr
147.碳化物：carbide
148.定位梢：carlson pin
149.载运剂：carrier
150.催化：catalyzing
151.阴极溅射法：catholicsputtering
152.隔板;钢板：caul plate
153.校验系统之各种要求：calibration system requirements
154.中心光束法：center beam method
155.集中式投射线：central projection
156.认证：certification
157.倒角(金手指)：chamfer chamfer
158.切斜边;倒角：chamfering
159.特性阻抗：characteristic impedance
160.电量传递过电压：charge transfer overpotential
161.网框：chase
162.棋盘：checkboard
163.蟹和剂：chelator
164.化学键：chemical bond
165.化学蒸着镀：chemical vapor deposition
166.圆周性之孔破：circumferential void
167.包夹金属：clad metal
168.无尘室：clean room
169.间隙：clearance
170.表面处理：Coating/Surface Finish
上即是pcb设计中专业英译术语之形状与尺寸